ISBN:
9780857099259
,
0857099256
,
1306949130
,
9781306949132
,
0857095269
,
9780857095268
Language:
English
Pages:
1 online resource
,
illustrations
Series Statement:
Woodhead Publishing series in electronic and optical materials
Parallel Title:
Erscheint auch als
DDC:
621.4
Keywords:
TECHNOLOGY & ENGINEERING / Mechanical
;
Silicon-on-insulator technology
;
Silicon-on-insulator technology
;
Silicon-on-insulator technology
;
CMOS
;
Halbleitersubstrat
;
SOI-Technik
;
Konferenzschrift
;
SOI-Technik
;
Halbleitersubstrat
;
CMOS
Abstract:
Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process helps reduce junction capacitance, resulting in higher speed and lower power consumption. SOI chips can be as much as 15 percent faster and use 20 percent less power than today's silicon complementary metal-oxide semiconductor (CMOS)-based chips. Part one covers SOI transistors and circuits, manufact
Note:
Includes bibliographical references and index
URL:
Volltext
(URL des Erstveröffentlichers)
