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  • 1
    Online Resource
    Online Resource
    [Erscheinungsort nicht ermittelbar] : KIT Scientific Publishing
    Language: Undetermined
    Pages: 1 Online-Ressource (220 p.)
    Keywords: Mechanical engineering & materials
    Abstract: The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load
    Note: German
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