Language:
Undetermined
Pages:
1 Online-Ressource (292 p.)
Series Statement:
Karlsruhe Series in Photonics & Communications
Keywords:
Electrical engineering
Abstract:
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML)
Note:
English
