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  • MPI Ethno. Forsch.  (1)
  • [Erscheinungsort nicht ermittelbar] : Frontiers Media SA
  • Boca Raton, FL : CRC Press
  • Physik  (1)
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  • MPI Ethno. Forsch.  (1)
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  • 1
    Online-Ressource
    Online-Ressource
    Boca Raton, FL : CRC Press
    ISBN: 1439814678 , 9781439814673 , 9781439814680 , 1439814686 , 9781322623443 , 1322623449
    Sprache: Englisch
    Seiten: 1 online resource (xv, 491 pages, 16 unnumbered leaves of color plates) , illustrations
    Paralleltitel: Erscheint auch als
    RVK:
    Schlagwort(e): Electronic apparatus and appliances Thermal properties ; Electronic apparatus and appliances Protection ; Heat sinks (Electronics) ; Electronic packaging ; System failures (Engineering) Prevention ; Appareils électroniques ; Propriétés thermiques ; Appareils électroniques ; Protection ; Dissipateurs thermiques (Électronique) ; Mise sous boîtier (Électronique) ; Pannes ; Prévention ; TECHNOLOGY & ENGINEERING ; Mechanical ; Electronic apparatus and appliances ; Protection ; Electronic apparatus and appliances ; Thermal properties ; Electronic packaging ; Heat sinks (Electronics) ; Wärmeübertragung
    Kurzfassung: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.
    Anmerkung: Includes bibliographical references and index. - Online resource; title from digital title page (viewed on April 2, 2019)
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