Online Resource
[Erscheinungsort nicht ermittelbar] : KIT Scientific Publishing
Language:
Undetermined
Pages:
1 Online-Ressource (220 p.)
Keywords:
Mechanical engineering & materials
Abstract:
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load
Note:
German
Permalink
Library |
Location |
Call Number |
Volume/Issue/Year |
Availability |